Advanced Materials for Thermal Management of Electronic Packaging

Author: Xingcun Colin Tong
Publisher: Springer Science & Business Media
ISBN: 1441977597
Release Date: 2011-01-05
Genre: Technology & Engineering

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Advanced Thermal Management Materials

Author: Guosheng Jiang
Publisher: Springer Science & Business Media
ISBN: 9781461419624
Release Date: 2012-09-14
Genre: Technology & Engineering

Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions.

RF and Microwave Microelectronics Packaging

Author: Ken Kuang
Publisher: Springer Science & Business Media
ISBN: 1441909842
Release Date: 2009-12-01
Genre: Technology & Engineering

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

Advanced Adhesives in Electronics

Author: M O Alam
Publisher: Elsevier
ISBN: 9780857092892
Release Date: 2011-05-25
Genre: Technology & Engineering

Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques

Fan Out Wafer Level Packaging

Author: John H. Lau
Publisher: Springer
ISBN: 9789811088841
Release Date: 2018-04-05
Genre: Technology & Engineering

This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.

Materials Selection in Mechanical Design Das Original mit bersetzungshilfen

Author: Michael F. Ashby
Publisher: Spektrum Akademischer Verlag
ISBN: 3827417627
Release Date: 2006-10-19
Genre: Technology & Engineering

Das englischsprachige, weltweit anerkannte Standardwerk zur Werkstoffauswahl - als neuer Buchtyp speziell für die Bedürfnisse deutschsprachiger Leser angepasst! Der Zusatznutzen, den dieses Buch bietet ist das Lesen und Lernen im englischen Original zu erleichtern und gleichzeitig in die spezielle Fachterminologie einzuführen und zwar durch: - Übersetzungshilfen in der Randspalte zur Fachterminologie und zu schwierigen normalsprachlichen Ausdrücken - Ein zweisprachiges Fachwörterbuch zum raschen Nachschlagen

Digitale Audiosignalverarbeitung

Author: Udo Zölzer
Publisher: Springer-Verlag
ISBN: 9783322967695
Release Date: 2013-03-08
Genre: Technology & Engineering

Das Buch gibt einen Einblick in die Algorithmen und Verfahren zur digitalen Verarbeitung von Audiosignalen.

Technologie hochintegrierter Schaltungen

Author: Dietrich Widmann
Publisher: Springer-Verlag
ISBN: 9783642970597
Release Date: 2013-03-13
Genre: Technology & Engineering

Im vorliegenden Buch wird die Technologie von hochintegrierten Schaltungen behandelt. Es werden zunächst sehr ausführlich und praxisnah die verschiedenen technologischen Verfahren und Einzelprozesse aus den Bereichen Lithographie, Schicht-, Ätz- und Dotiertechnik beschrieben. Danach folgen Beispiele für die Integration der Einzelprozesse zur Herstellung von CMOS-, Bipolar- und BICMOS-Schaltungen. Sowohl die Einzelprozesse als auch die Prozeßintegration sind anschaulich mit zahlreichen Bildern dargestellt. Das Buch vermittelt nicht nur eine gute Übersicht, sondern auch sehr detaillierte Informationen über den modernsten Stand der Technologie hochintegrierter Schaltungen, wie sie z.B. bei der Herstellung des dynamischen IMEGA-Bit-Speichers Anwendung findet. Darüber hinausgehende Entwicklungen, die in den Sub-Mikrometer-Bereich führen, werden ebenfalls beschrieben.

Die Evolution des Fliegens Ein Fotoshooting

Author: Georg Glaeser
Publisher: Springer-Verlag
ISBN: 9783662498996
Release Date: 2016-10-10
Genre: Science

Dieser Band nimmt sie mit auf eine spannende Reise in Bildern und Texten. Spektakuläre, großformatige Fotos auf Doppelseiten mit einem Erklärungstext machen die Leser neugierig auf das, was die Evolution im Bereich des Fliegens hervorgebracht hat: von der pflanzlichen Luftflotte (Pollenkörner, Flugsamen,...) über fliegende Schlangen und Fische, unter Wasser fliegende Pinguine bis zum Menschen, der sich in die Lüfte erhebt. Das Buch kann in beliebiger Reihenfolge, Doppelseite für Doppelseite, gelesen werden. Querverweise sorgen für bequemes Umspringen auf andere Doppelseiten. Die Textpassagen sind zumeist - abgesehen von der fundierten Einleitung - unabhängig von einander und besprechen besondere Highlights im evolutionären Prozess. Ergänzt wird die Doppelseite mit Literaturhinweisen und Verweisen auf instruktive Internet-Seiten.

Microelectronic Interconnections and Assembly

Author: G.G. Harman
Publisher: Springer Science & Business Media
ISBN: 9789401151351
Release Date: 2012-12-06
Genre: Technology & Engineering

MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.