This invaluable second volume of a two-volume set is filled with details about the integrated circuit design for space applications. Various considerations for the selection and application of electronic components for designing spacecraft are discussed. The basic constructions of submicron transistors and schottky diodes during the technological process of production are explored. This book provides details on the energy consumption minimization methods for microelectronic devices. Specific topics include: Features and physical mechanisms of the effect of space radiation on all the main classes of microcircuits, including peculiarities of radiation impact on submicron integrated circuits;Special design, technology, and schematic methods of increasing the resistance to various types of space radiation;Recommendations for choosing research equipment and methods for irradiating various samples;Microcircuit designers on the composition of test elements for the study of the effect of radiation;Microprocessors, circuit boards, logic microcircuits, digital, analog, digital–analog microcircuits manufactured in various technologies (bipolar, CMOS, BiCMOS, SOI);Problems involved with designing high speed microelectronic devices and systems based on SOS-and SOI-structures;System-on-chip and system-in-package and methods for rejection of silicon microcircuits with hidden defects during mass production.
This authoritative first volume provides a solid understanding of modern spacecraft classification, failure, and electrical component requirements. This book focuses on the study of modern spacecraft, including their classification, packaging and protection, design versions, launch failure and accident analysis, and the main requirements of electronic components used. Readers find comprehensive coverage of the design and development of individual components as well as systems, their packaging, and how to make them last in space. This is a useful resource for military and civil applications. Specific topics include: The manufacturing of electronics for space; The main physical mechanisms of the impact of destabilizing factors of outer space, including various kinds of radiation, high-energy galactic icons, and particles of cosmic dust;The design of advanced space-grade microelectronic products such as memory microcircuits, microprocessors, interface and logic of microcircuits and power control microcircuits;Facts and features about the “space race” that have not been available until now.
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization
Author: G. W. A. Dummer
Release Date: 2014-05-16
Genre: Technology & Engineering
Solid Circuits and Microminiaturization is a collection of the proceedings of the Conference on Solid Circuits and Microminiaturization held at West Ham College of Technology in the UK in June 1963. The conference provided a forum for discussing trends in the microminiaturization of solid circuits and covered a wide range of topics related to the subject, including the design and manufacture of solid circuits; solid circuit fabrication techniques and the resulting passive component characteristics; and equipment design philosophy using integrated circuits. This book is comprised of 27 chapters and begins with an overview of the status and trends in microminiaturization, followed by a description of the techniques used to fabricate solid state circuits and a comparison of the properties of various types of solid state circuits. Subsequent chapters focus on the approaches used in the design and manufacture of solid circuits; characteristics and application of micrologic elements; techniques for the use of solid circuits together with conventional components in miniaturized assemblies; and the application of solid state circuits to computer design. High-speed integrated digital circuits and a group of integrated circuits for linear amplification are also described. This monograph will be of particular value to electronics engineers and systems designers.
Author: Bob McQueen
Publisher: Artech House
Release Date: 2017-08-31
This practical new book presents the application of “big data” analytics to connected vehicles, smart cities, and transportation systems. This book enables transportation professionals to understand how data analytics can and will expand the design and engineering of connected vehicles and smart cities. Readers find extensive case studies and examples that provide a strong framework focusing on practical application of data sciences and analytic tools for actual projects in the field. Both federal and private sector investments have a strong interest in the connected vehicle and this book discusses the impact this has on transportation. This book defines urban analytics and modeling, incentives and governance, mobility networks, energy networks, and other attributes and elements that craft a smart city. Readers learn how smart cities impact the application of advanced technologies in urban areas. This book explains how recently passed transportation legislation for the US has a specific emphasis on the use of data for performance management.
Author: Behzad Razavi
Publisher: John Wiley & Sons
Release Date: 2012-09-14
Genre: Technology & Engineering
The only book on integrated circuits for optical communications that fully covers High-Speed IOs, PLLs, CDRs, and transceiver design including optical communication The increasing demand for high-speed transport of data has revitalized optical communications, leading to extensive work on high-speed device and circuit design. With the proliferation of the Internet and the rise in the speed of microprocessors and memories, the transport of data continues to be the bottleneck, motivating work on faster communication channels. Design of Integrated Circuits for Optical Communications, Second Edition deals with the design of high-speed integrated circuits for optical communication transceivers. Building upon a detailed understanding of optical devices, the book describes the analysis and design of critical building blocks, such as transimpedance and limiting amplifiers, laser drivers, phase-locked loops, oscillators, clock and data recovery circuits, and multiplexers. The Second Edition of this bestselling textbook has been fully updated with: A tutorial treatment of broadband circuits for both students and engineers New and unique information dealing with clock and data recovery circuits and multiplexers A chapter dedicated to burst-mode optical communications A detailed study of new circuit developments for optical transceivers An examination of recent implementations in CMOS technology This text is ideal for senior graduate students and engineers involved in high-speed circuit design for optical communications, as well as the more general field of wireline communications.
Author: Angeliki Kritikakou
Publisher: Springer Science & Business Media
Release Date: 2014-03-21
Genre: Technology & Engineering
This book describes scalable and near-optimal, processor-level design space exploration (DSE) methodologies. The authors present design methodologies for data storage and processing in real-time, cost-sensitive data-dominated embedded systems. Readers will be enabled to reduce time-to-market, while satisfying system requirements for performance, area, and energy consumption, thereby minimizing the overall cost of the final design.
This book provides students and practicing chip designers an easy-to-follow yet thorough, introductory treatment of the most promising emerging memories under development in the industry. Focusing on the chip designer rather than the end user, this book offers expanded, up-to-date coverage of emerging memories circuit design. After an introduction on the old solid-state memories and the fundamental limitations soon to be encountered, the working principle and main technology issues of each of the considered technologies (PCRAM, MRAM, FeRAM, ReRAM) are reviewed and a range of topics related to design is explored: the array organization, decoding, sensing and writing circuitry, data path design, redundancy and error correction, I/O interfaces, power requirements are reviewed comparing the approach followed and the constraints for each of the technologies considered.Additionally some considerations are entertained about how emerging memories can find a place in the new memory paradigm required by future electronic systems.This book is an up-to-date and comprehensive introduction for students in courses on memory circuit design or advanced digital courses in VLSI or CMOS circuit design. It also serves as an essential, one-stop resource for academics, researchers and practicing engineers.
Author: Arjun N. Saxena
Publisher: World Scientific
Release Date: 2009
This book is the first to give an authoritative and comprehensive account of the invention of Integrated Circuits (ICs) from an insider who had participated and contributed from the beginning of their invention and advancement to the Ultra Large Scale ICs (ULSICs) of today. It reads like a mystery novel to engross the reader, but it is not based on fiction; it gives documented facts of the invention of ICs, analyzes the patents, and highlights additional details and clarifications of their history. In addition, the book clarifies the Nobel Prize award and raises intriguing questions which as yet remain unanswered even after about half a century since the ICs were invented. This is the invention which has revolutionized the whole world forever!
Electrical Engineering Low-Voltage/Low-Power Integrated Circuits and Systems Low-Voltage Mixed-Signal Circuits Leading experts in the field present this collection of original contributions as a practical approach to low-power analog and digital circuit theory and design, illustrated with important applications and examples. Low-Voltage/Low-Power Integrated Circuits and Systems features comprehensive coverage of the latest techniques for the design, modeling, and characterization of low-power analog and digital circuits. Low-Voltage/Low-Power Integrated Circuits and Systems will help you improve your understanding of the trade-offs between analog and digital circuits and systems. It is an invaluable resource for enhancing your designs. This book is intended for senior and graduate students. It is also intended as a key reference for designers in the semiconductor and communication industries. Highlighted applications include: Low-voltage analog filters Low-power multiplierless YUV to RGB based on human vision perception Micropower systems for implantable defibrillators and pacemakers Neuromorphic systems Low-power design in telecom circuits
Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.
Essential reading for experts in the field of RF circuit design and engineers needing a good reference. This book provides complete design procedures for multiple-pole Butterworth, Chebyshev, and Bessel filters. It also covers capacitors, inductors, and other components with their behavior at RF frequencies discussed in detail. Provides complete design procedures for multiple-pole Butterworth, Chebyshev, and Bessel filters Covers capacitors, inductors, and other components with their behavior at RF frequencies discussed in detail